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Embedded RF Filters for WLAN and Bluetooth Applications

[+] Author Affiliations
Telesphor Kamgaing, Jiangqi He, Rockwell Hsu

Intel Corporation, Chandler, AZ

Paper No. IPACK2005-73319, pp. 1621-1624; 4 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


This paper discusses the design and integration of RF filters in multilayer organic substrate. Using a methodic approach, several low-pass and band-pass filters have been designed, fabricated and fully characterized. The electrical analysis clearly indicates, which of the low-pass filters is less susceptible to process variations and therefore more appropriate for high volume manufacturing. It is shown that these filters provide electrical performance similar to their commercially available ceramic counterparts while using relatively smaller real estate. All filters are fabricated in the innermost layers of a multilayer organic package substrate with embedded passives capability.

Copyright © 2005 by ASME
Topics: Filters , Wireless LAN



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