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3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

[+] Author Affiliations
J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris

Georgia Institute of Technology, Atlanta, GA

Paper No. IPACK2005-73127, pp. 1607-1611; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


In this paper, the development of three-dimensional (3-D) millimeter-wave functions in multilayer low temperature cofired ceramic (LTCC) and liquid crystal polymer (LCP) technologies is presented for millimeter-wave compact and easy-to-design passive solutions for high data rate wireless systems. Both ceramic and organic technologies are candidates for the 3-D integration of system-on-package (SOP) miniaturized RF/microwave/millimeter-wave systems. LTCC has been widely used as a packaging material because of its process maturity/stability and its relatively high dielectric constant that enables a significant reduction in the module/function dimensions. As an alternative, LCP is an organic material that offers a unique combination of electrical, chemical, and mechanical properties, enabling high-frequency designs due to its ability to act as both the substrate and the package for flexible and conformal multilayer functions. A LTCC patch resonator filter that uses vertical coupling overlap and transverse cuts as design parameters has been designed to achieve a high level of miniaturization and a great compromise between compactness and power handling. Excellent agreement between the simulation and the measurement has been verified for two operating frequency bands (58–60GHz/38–40GHz) of RF communications and sensors for applications such as wireless broadband internet or inter-satellite communications. A band pass filter has been fabricated on LCP substrate, offering a very simple, low loss flexible and low lost filtering solution for wideband millimeter waves applications such as 60 GHz WLAN short-range gigabit wireless systems. The design exploits the ripple near the cut off frequency of Tchebysheff low pass filter to create a band pass response and it exhibits the insertion loss as low as 1.5 dB at the center frequency of 60GHz and 3-dB bandwidth of 16.7% (∼10 GHz).

Copyright © 2005 by ASME



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