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Shadow Moiré Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions

[+] Author Affiliations
Phil Geng, Robert R. Martinson, Richard L. Williams, Michael Mello, Steve Cho

Intel Corporation, Hillsboro, OR

Paper No. IPACK2005-73046, pp. 1583-1586; 4 pages
doi:10.1115/IPACK2005-73046
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

This work investigated the motherboard coplanarity and preload correlation using the shadow moiré interferometry. Motherboards under three different preloads in the CPU area were examined at room temperature and elevated temperature. Both the global board warpage and the local board warpage around the CPU area were measured for preload and temperature correlations. The measured board coplanarity was correlated to the board preload successfully. The results clearly identified a failure mode from the outlier, which has totally different warpage shape and corresponds to the uneven preload case. Also, the creep effect under preload during heating stage was observed and quantified.

Copyright © 2005 by ASME

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