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Thermal Characterization and Modeling of Stacked Die Packages

[+] Author Affiliations
P. Szabo, G. Farkas

MicReD Ltd., Budapest, Hungary

M. Rencz, V. Székely, A. Poppe

Budapest University of Technology and Economics, Budapest, Hungary

B. Courtois

TIMA Lab, Grenoble, France

Paper No. IPACK2005-73437, pp. 1575-1581; 7 pages
doi:10.1115/IPACK2005-73437
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

The main issues in the thermal characterization and modeling of stacked die packages are the appropriate model generation, and the qualification of the die attach quality between the different layers of the stacked die structures. The first part of the paper gives a short introduction of stacked die packages. The next chapter describes the main issues of steady state and transient compact model generation for the thermal behavior of stacked die packages. The third large part of the paper gives an overview of the different methodologies applied today for the quality characterization of the different die attach layers, as a major indicator of the reliability of the package.

Copyright © 2005 by ASME

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