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Electronic Board/System Nonlinearity Characterization for Dynamic Analysis

[+] Author Affiliations
Frank Z. Liang, Wade Hezeltine, Richard L. Williams

Intel Corporation, Hillsboro, OR

Paper No. IPACK2005-73277, pp. 1493-1497; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Many electronic boards or systems exhibit nonlinear behaviors during shock or vibration tests. One of the challenges for dynamics analysis of electronic boards or systems is to deal with these nonlinearities. In order to solve the nonlinear problem, the nonlinearities need to be revealed and characterized and their effects understood. This paper demonstrates the methods in identifying the nonlinearities and supported with empirical tests. Shock, random vibration and static bending were used to reveal the board system nonlinearities. The empirical results provided direction to update shock FE models.

Copyright © 2005 by ASME



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