Full Content is available to subscribers

Subscribe/Learn More  >

Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects

[+] Author Affiliations
Alex Vukovic, Michel Savoie

Communications Research Centre Canada, Ottawa, ON, Canada

Paper No. IPACK2005-73039, pp. 1375-1377; 3 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Parallel optical interconnects (POIs) offer capacity advantages for high-density telecomm requirements. Once an array of multi-channel, high-capacity POIs is placed on a board, shelf or telecom rack, it creates a challenging thermal management task. To develop a thermal management concept for high dissipating racks (over 10 kW), capable of keeping a maximum temperature of 80°C for optical components, with tight temperature uniformity requirements of ±1°C between a receiver (Rx) and transmitter (Tx), a fully functional two-shelf telecommunication rack has been built. A thermal management solution was proposed and was based on the implementation of heat pipes embedded into each board. The performance of embedded heat pipes is characterized for densely packaged, high-speed optics applications requiring temperature uniformity and stringent temperature limits. The proposed solution completely meets requirements of power-dense, high speed POIs at the board/shelf level for the typical telecommunication rack. Moreover, it evolves into an enabling strategy for the reliable control of power-dense, temperature-sensitive optical components.

Copyright © 2005 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In