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Characterization of Maximum Current Capacity for Microprocessor Sockets

[+] Author Affiliations
David Song, Ashish Gupta, Chia-Pin Chiu

Intel Corporation, Chandler, AZ

Paper No. IPACK2005-73035, pp. 1371-1374; 4 pages
doi:10.1115/IPACK2005-73035
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

This paper presents the current-carrying-capacity (CCC) characterization of a land-grid-array type microprocessor socket. This CCC study has been performed using both computational modeling and experiments using infrared camera. A subsequent risk assessment was performed against the maximum allowed temperature at the point of pressure contact of socket pin for the use-condition socket pin current and motherboard temperature. The results from the modeling and the experimental results are compared.

Copyright © 2005 by ASME

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