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A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations

[+] Author Affiliations
L. T. Yeh, Joseph Yeh

Thermal Consultant, Dallas, TX

B. T. F. Chung

University of Akron, Akron, OH

Paper No. IPACK2005-73008, pp. 1359-1364; 6 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


A CFD thermal and air flow analysis is performed for a given telecommunication rack. The commercial software, Flotherm, is employed to perform the system level analysis. The analysis is made to examine the effects of the air filter locations at the upstream and downstream of the fans on the flow distribution within the system. The analysis is then extended to the case with one-fan failure condition.

Copyright © 2005 by ASME



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