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Development and Application of Mechanical and Reliability Models for Connectors and Sockets

[+] Author Affiliations
Raymond J. Iannuzzelli, Javad A. Seyyedi, Daniel L. Callahan

Hewlett-Packard Company, Amherst, NH

Paper No. IPACK2005-73007, pp. 1351-1358; 8 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Designing a modern server today requires considerable attention to interconnect details. Connectors & sockets represent a class of interconnect that find abundant use in most computers. Due to their continual evolution toward smaller footprints, tighter pitch, shorter paths, and better electrical performance, connectors and sockets are at the technological forefront in computer packaging. The challenges in designing, understanding, and applying connectors & sockets can be addressed through the application of advanced modeling techniques. This paper will address the development and application of mechanical models for a Rambus In-line Memory Module (RIMM® ) connector and a Land Grid Array (LGA) interposer socket. Common issues of material properties, appropriate boundary conditions, and loads will be addressed. The models are applied to show the importance in understanding: connector design, friction, load-unload hystereses, and non-linear contacting.

Copyright © 2005 by ASME



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