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Constitutive Modeling of Lead-Free Solders

[+] Author Affiliations
M. Pei, J. Qu

Georgia Institute of Technology, Atlanta, GA

Paper No. IPACK2005-73411, pp. 1307-1311; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical testing on several commercial lead-free solder alloys. Anand viscoplastic model was used to describe the behavior of these materials with new curve fitting techniques. A modified Anand models was proposed that can yield a more accurate description of lead-free solders.

Copyright © 2005 by ASME



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