0

Full Content is available to subscribers

Subscribe/Learn More  >

Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias

[+] Author Affiliations
M. Reid, J. Punch, B. Rodgers

University of Limerick, Limerick, Ireland

T. Galkin, T. Stenberg, O. Rusanenc, E. Elonen, M. Vilèn, K. Väkeväinen

Nokia Corporation, Finland

Paper No. IPACK2005-73353, pp. 1271-1276; 6 pages
doi:10.1115/IPACK2005-73353
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

Ionic migration has been the subject of intensive study, both theoretical and experimental, over the past 40 years. It is known as a reliability concern for printed wiring boards (PWBs) in high density microelectronic packaging and power electronic packaging. Ionic migration is an electrochemical phenomena that occurs primarily under normal ambient conditions: i.e. when the local temperatures and current densities are low enough to allow moisture on the surface. Standardised test 85°C/85%RH is typically used for accelerating and predicting ionic migration failure, however, the possibility of moisture condensation — a prerequisite for ionic migration — at a relatively high temperature and low relative humidity is unlikely. In order to assess more realistic and less thermally severe environments, this work examines prolonged steady state exposure of PWBs. Steady-state conditions of 90%RH at 30°C under a bias of 5V DC were tested over a 210 day period with continuous in-situ monitoring of dendritic growth. Investigative techniques were conducted to evaluate the migration development on the PWBs after testing using optical microscopy, scanning electron microscopy (SEM) and energy dispersive X-ray analysis (EDS). This paper will demonstrate that steady-state thermal humidity bias (THB) tests appear to provide ionic migration behaviour similar in service conditions, however, do not demonstrate the dramatic failure associated with ionic migration.

Copyright © 2005 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In