0

Full Content is available to subscribers

Subscribe/Learn More  >

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

[+] Author Affiliations
Jin Liang

EMC Corporation, Hopkinton, MA

Xiaodong Li, Zhi-Hui Xu

University of South Carolina, Columbia, SC

Dongkai Shangguan

Flextronics, San Jose, CA

Paper No. IPACK2005-73233, pp. 1199-1205; 7 pages
doi:10.1115/IPACK2005-73233
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

Tin whisker formation has been a serious concern for application of pure Tin as a Pb-free component lead finish. It has been long believed that residual stress is the root cause of whisker formation. A fundamental question is if stress produced by other than the plating processing and post-plating metallurgical reactions can induce whisker formation. In this study, micro indents were made on pure Tin plated component leads to induce stress for studying stress induced whisker formation. Nano-indentation was performed to measure hardness and elastic modulus of the Tin coating layer where whiskers initiate. Scanning electron microscopy (SEM) was used to study indentation deformation mechanisms and to monitor the nucleation and growth of whiskers in-situ. In additions, finite element analysis was carried out to theoretically calculate the stress/strain distribution around the indentations. Experimental and theoretical calculation results show that whiskers form at a certain stress level. This suggests that there might exit a critical stress threshold that governs the whisker formation. It is believed that establishment of a quantitative relationship between stress level and whisker formation/growth could lead to a breakthrough in risk and reliability assessment with pure Tin application in the electronic industry and in safeguard for smooth Pb-free transition.

Copyright © 2005 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In