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Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

[+] Author Affiliations
Saket Karajgikar, Wonkee Ahn, Dereje Agonafer

University of Texas at Arlington, Arlington, TX

Paper No. IPACK2005-73184, pp. 1187-1192; 6 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


PWB also known as Printed Circuit Board (PCB) provides the physical structure for mounting and holding the electronic components and electrically connecting it. They are foundation of virtually all of the electronic devices. Typically they are multilayer structures consisting of organic/composites (e.g. FR4) and circuit layers, laminated together. Such multi-layered structures exhibit ‘board warpage’ during manufacturing process. It is a result of residual thermo-mechanical stresses along with any asymmetries (if present) during the curing process. This effect further increases when the board undergoes thermal cycling during component mounting and reflow process. Effect of different parameters such as board size, board thickness, and pressure (at the time of developing) on PWB warpage is studied.

Copyright © 2005 by ASME



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