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Micro-Via Reliability Study of High-Density Substrate

[+] Author Affiliations
Youhong Wu

Ibiden Co., Ltd., Ibigawa, Gifu, Japan

Paper No. IPACK2005-73156, pp. 1177-1180; 4 pages
doi:10.1115/IPACK2005-73156
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

The micro-via dimension of substrate decreased rapidly as the I/O density of substrate dramatically increased to meet the high market needs. However, the strength of micro-via becomes weak, and will be easily broken during the manufacturing process or reliability test. The purpose of this study is to understand the key effective factors of the micro-via reliability with the 3D non-linear thermal stress analysis using the Multi-scaling modeling (submodeling) technique.

Copyright © 2005 by ASME
Topics: Density , Reliability

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