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Adhesion Strength at High Temperatures Affected by Moisture for Die-Attach Materials of Integrated Circuit Packages

[+] Author Affiliations
Hiroyuki Tanaka, Takashi Numata

Sumitomo Bakelite Company, Ltd., Utsunomiya, Japan

Paper No. IPACK2005-73139, pp. 1153-1158; 6 pages
doi:10.1115/IPACK2005-73139
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

This paper presents a method of finite element analysis for calculating moisture concentration in non-isothermal and non-steady states of moisture for integrated circuit packages composed of dissimilar moisture-permeable materials. The method can address non-Fickian behavior of materials in moisture diffusivity. Specimens were put on a hot plate after pre-conditioning in a moist environment. Distribution of moisture concentration in the specimen used in adhesion strength measurement was calculated in the temperature-change process. Comparatively large change in moisture concentration occurs in the neighborhood of the dissimilar material interface during that process, demonstrating that adhesion strength between die-attach material and printed circuit board at high temperatures might have greater moisture-sensitivity than at low temperatures.

Copyright © 2005 by ASME

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