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Evaluation System for Ionic Migration On/In the Superconnect Leveled Printed Circuit Board by Means of AC Impedance Method

[+] Author Affiliations
Sachio Yoshihara

Utsunomiya University, Tochigi, Japan

Paper No. IPACK2005-73097, pp. 1123-1127; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Micro-fabricated Printed Circuit Boards (PCB) using environmental friendly materials and processes will be desirable candidates for future electronic packaging technologies. To investigate the ionic migration for thus developed PCB, quite new measurement method has been developed by the authors, which enables real time monitoring of the growth process of ionic migration using AC impedance method. Electric reliability of the newly developed copper printed circuit boards by Japan NEDO project (L/S = 4/6, 8/12, 12/16 μm) using polyimide, etc as the insulating layer have been evaluated under 85°C, 85%RH. The generation of the migration was also tested by conventional time dependence of current under bias of 5.0 V or 100 V. The progress of the migration could be investigated by AC Impedance method (Cole-Cole plots). The degradation of the diameter of the impedance loop suggested the intimation of migrations.

Copyright © 2005 by ASME



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