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A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

[+] Author Affiliations
John Lau

Agilent Technologies, Inc., Santa Clara, CA

Ricky Lee, Fubin Song, Dennis Lau

Hong Kong University of Science and Technology, Kowloon, Hong Kong, P.R. China

Walter Dauksher

Agilent Technologies, Inc., Fort Collins, CO

Dongkai Shangguan

Flextronics, Inc., San Jose, CA

Paper No. IPACK2005-73364, pp. 1021-1029; 9 pages
doi:10.1115/IPACK2005-73364
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Copyright © 2005 by ASME

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