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Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

[+] Author Affiliations
John Lau

Agilent Technologies, Inc., Santa Clara, CA

S. W. Ricky Lee, Fubin Song, Dennis C. Lau

Hong Kong University of Science and Technology, Kowloon, Hong Kong, P.R. China

Dongkai Shangguan

Flextronics, San Jose, CA

Walter Dauksher

Agilent Technologies, Inc., Fort Collins, CO

Paper No. IPACK2005-73362, pp. 1013-1019; 7 pages
doi:10.1115/IPACK2005-73362
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

A new thermal-fatigue life prediction equation for a class of lead-free solder alloys, 95.5wt%Sn4.0wt%Ag0.5wt%Cu, is proposed in this investigation. The test vehicle consists of a lead-free solder plastic ball grid array (PBGA) package, a lead-free PCB, and lead-free solder paste (95.5wt%Sn3.9wt%Ag0.6wt%Cu). The coefficients of the fatigue equation presented herein are determined by best fit of the test vehicle’s isothermal fatigue data. Failure modes and locations of the failed samples are discussed.

Copyright © 2005 by ASME

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