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An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems

[+] Author Affiliations
Lesley Polka, Ravi Mahajan, Johanna Swan, Gaurang Choksi

Intel Corporation, Chandler, AZ

Paper No. IPACK2005-73320, pp. 971-975; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Research and development on System in Package (SiP) technologies is prevalent now both in industry and academia. This paper provides an overview of SiP from a CPU and communications systems perspective. Some of the items that will be covered include what defines a “system” for SiP, what value a SiP architecture brings, the types of SiP packaging architectures and technologies, and the challenges involved with developing SiP solutions.

Copyright © 2005 by ASME



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