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Deformation and Fatigue Fracture of Pb-Free Solder Alloys Under Complicated Load Conditions

[+] Author Affiliations
J. Liang, N. Dariavach, P. Callahan

EMC Corporation, Hopkinton, MA

D. Shangguan

Flextronics, San Jose, CA

X. Li

University of South Carolina, Columbia, SC

Paper No. IPACK2005-73257, pp. 927-938; 12 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Fundamental study of deformation and fatigue fracture behavior of solder alloys under complex load conditions is a key to enabling implementation of sophisticated 3-D time-dependent nonlinear FEM stress and strain analyses and life assessment for electronic packages and assemblies. In this study, the rate-dependent deformation and fatigue fracture behavior of Sn3.8Ag0.7Cu Pb-free alloy and Sn-Pb eutectic alloy was investigated with thin-walled specimens using a bi-axial servo-controlled tension-torsion material testing system, with solder alloys subjected to a variety of complex load conditions: pure shearing at strain rates between 6.7×10−7 /sec to 1.3×10−1 /sec, creep at temperatures ranging from room temperature up to 125 °C, and cyclic loading with frequency of 0.001Hz to 3Hz. Bi-axial stress conditions were imposed for shearing tests to investigate effects of multi-axial stresses on deformation behavior. The effects of frequency and temperature on cyclic deformation and fatigue facture were investigated for lead-free Sn3.8Ag0.7Cu and Sn-Pb eutectic solder. Fractography of fatigue tested samples were also conducted to determine possible fatigue failure mechanisms.

Copyright © 2005 by ASME



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