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The Sintering Process of Ag Metallo-Organic Nanoparticles and the Influence of the Joining Parameters Upon Cu-to-Cu Joining

[+] Author Affiliations
Shinji Angata, Eiichi Ide, Akio Hirose, Kojiro F. Kobayashi

Osaka University, Suita, Osaka, Japan

Paper No. IPACK2005-73164, pp. 887-892; 6 pages
doi:10.1115/IPACK2005-73164
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

We propose a novel bonding process using Ag metallo-organic nanoparticles as a new application of nanotechnologies. The average size of the Ag nanoparticle is approximately 11 nm, and each nanoparticle is covered with an organic shell. Usually, the agglomeration of metallic nanoparticles is unavoidable due to its large surface energy. However, on the account of the organic shell, these Ag nanoparticles exist individually, and once the organic shell has been removed, these Ag nanoparticles turn activated and abruptly agglomerate. We analyzed its thermal characteristics, applied the agglomerating of the nanoparticles to Cu-to-Cu joining, and researched the influence of the bonding condition, such as bonding pressure, temperature or holding time, upon the joint strengths. The joint strengths using the nanoparticles were 30–40 MPa, which is strong enough to be applied as a solder. In addition, it came to the conclusion that the strengths increased in accord with the aforesaid three parameters.

Copyright © 2005 by ASME

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