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Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow

[+] Author Affiliations
Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic

Intel Corporation, Chandler, AZ

Paper No. IPACK2005-73086, pp. 717-725; 9 pages
doi:10.1115/IPACK2005-73086
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

We have performed a parametric study of the thermal and hydraulic performance of silicon-based micro pin fin heat exchangers with water as the fluid. Circular and square micro pin fins have been fabricated. The pin dimensions ranged from 50 μm to 150 μm. The test chip is unique because it has 20 micro temperature sensors of the size 75 μm × 75 μm to accurately capture the thermal resistance of the micro pin fin heat exchanger. Data shows that there is no difference in the hydraulic and the thermal resistance of circular and square pins. Conventional correlations for friction factor and Nusselt number match well with the data.

Copyright © 2005 by ASME

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