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Experimental Validation of Channeled Wall Passive Cooling Enhancement

[+] Author Affiliations
Kazuaki Yazawa

Sony Corporation, Tokyo, Japan

Yasushi Nishino, Shinji Nakagawa, Masaru Ishizuka

Toyama Prefectural University, Kosugi, Toyama, Japan

Paper No. IPACK2005-73078, pp. 709-716; 8 pages
doi:10.1115/IPACK2005-73078
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

Passive cooling enhancement with least additional mass of the material on the external wall can be a method for least energy thermal management for the consumer electronics. Previously, the channeled wall enhancement was found to have potentially four fold performance compare to the single wall in the analysis work, in which the enhancement factor with optimum shape with appropriate thermal conductivity of the material was presented. This method is assumed promising to help the energy efficient and quieter thermal design without sacrificing the valuable flat cosmetic surface of equipment. In this paper, flow regime in a channel composite wall is observed experimentally with PIV method as well as thermal resistance of the wall is observed in the same apparatus. These observation results are discussed with numerical analysis. The discussion is summarized with cooling enhancement factor based on the allowable temperature with comparing to the single wall. The result provides the strong evidence for the optimization on proposed analytic models.

Copyright © 2005 by ASME
Topics: Cooling

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