0

Full Content is available to subscribers

Subscribe/Learn More  >

A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects

[+] Author Affiliations
Bing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl

Georgia Institute of Technology, Atlanta, GA

Paper No. IPACK2005-73416, pp. 605-610; 6 pages
doi:10.1115/IPACK2005-73416
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

We demonstrate a prototype chip-scale microfluidic cooling scheme. CMOS compatible processes allow the monolithic integration of the microchannel heat sink into the backside of a Si chip at low temperature (≤260°C). At the front side of a chip, fine pitch area-array solder bumps are fabricated by electroplating for high-density electrical I/O interconnection, while a peripheral array of micro polymer pipes are fabricated as thermal-fluidic I/O interconnects. The resulting “microfluidic flip chip” can be bonded onto a liquid-cooled board substrate using conventional flip-chip assembly processes. The cooling liquid can, therefore, be transferred into a Si chip directly from the board-level manifolds to alleviate the thermal interface issues.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.

Copyright © 2005 by ASME
Topics: Cooling , Heat sinks

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In