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Effect of Data Center Layout on Rack Inlet Air Temperatures

[+] Author Affiliations
Roger Schmidt, Madhusudan Iyengar

IBM Corporation, Poughkeepsie, NY

Paper No. IPACK2005-73385, pp. 517-525; 9 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


The heat dissipated by large servers and switching equipment is reaching levels that make it very difficult to cool these systems in data centers or telecommunications rooms. Some of the highest powered systems are dissipating upwards of 4000 watts/ft2 (43,000 watts/m2 ) based on the equipment footprint. When systems dissipate this amount of heat and then are clustered together within a data center significant cooling challenges can result. This paper describes the thermal profile of 3 data center layouts (2 are of the same data center but different points in time with a different layout). Detailed measurements of all three were taken: electronic equipment power usage; perforated floor tile airflow; cable cutout airflow; computer room air conditioning (CRAC) airflow, temperatures and power usage; electronic equipment inlet air temperatures. Although the detailed measurements were recorded this paper will focus at the macro level results of the data center to see if some patterns present themselves that might be helpful for future guidelines of data center layout for optimized cooling. Specifically, areas of the data center where racks have similar inlet air temperatures are examined relative to the rack and CRAC unit layout.

Copyright © 2005 by ASME



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