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Thermal Characterization of Dual-Core Processor in Computer Equipment

[+] Author Affiliations
Manoj Nagulapally

Fluent, Inc., Austin, TX

Gamal Refai-Ahmed

ATI Technologies, Inc., Markham, ON, Canada

Paper No. IPACK2005-73365, pp. 487-491; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


A methodology to automatically construct both the topology and characteristics of a compact network model for a dual-core package is presented. The method is based on the multi-grid agglomeration of the underlying mesh used in the finite volume discretization of the energy conservation equation for the package. The procedure starts with a detailed mesh, either structured or unstructured, of the package and utilizes the physics contained in the underlying finite volume discretization to deduce network connectivities and resistances. In the study report herein, the method is applied to a dual-core package. This package is characterized using the above methodology and then used in steady-state CFD simulations. In these simulations, the package is mounted on a four-layer JEDEC thermal test board inside a JEDEC characterization chamber and subjected to a number of boundary conditions. The simulation results using the network model are compared to the corresponding detailed package simulations.

Copyright © 2005 by ASME



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