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Tactile Temperature Analysis of Home Theater System

[+] Author Affiliations
Ho Chul Ryu, Byung Ju Dan, In Ho Choi, Jin Yong Kim

LG Electronics, Inc., Sungnam-Si, Kyunggi-Do, Korea

Paper No. IPACK2005-73334, pp. 477-482; 6 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


In this work, the tactile temperature of home theater systems under natural convection conditions has been investigated through numerical approaches and experiment. The CFD analysis method was used to observe temperature changes of both the case top and the heat source. Based on numerical simulation results, four types of steel sheet mock-up having different vent sizes and locations were tested. As a consequence of the experiments, relationships in temperature variation between the case top and the heat source were investigated and verified. In addition, by using the validated and improved vent system, a fanless home theater system was proposed under high heat dissipating heat sources.

Copyright © 2005 by ASME
Topics: Temperature



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