0

Full Content is available to subscribers

Subscribe/Learn More  >

Assessing Capabilities and Limitations of Air- and Liquid-Cooling for Low Profile Servers

[+] Author Affiliations
Albert Chan

Fujitsu Laboratories of America, Sunnyvale, CA

Jie Wei

Fujitsu Limited, Kawasaki, Japan

Paper No. IPACK2005-73293, pp. 445-450; 6 pages
doi:10.1115/IPACK2005-73293
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

As microprocessor power exceeds 100W, adequate heat removal by convective air-flow through a heatsink increasingly becomes more challenging. This is especially true for low-profile servers with very limited volume for air-flow. It is therefore useful to have an idea of the limitations of air-cooling for such servers. In this paper, three case studies serve to illustrate the capability of typical air-cooled solutions for low-profile servers. These studies show the inherent limitations of air-cooled solutions for volume-constrained computer systems. Liquid-cooling has been used in cooling mainframe processors packaged in MCM format. Its use in low-cost servers is extremely limited. This paper will deal with issues that hinder widespread application of liquid-cooling in commercial servers. The most important issue is cost, followed by lack of commodity components suitable for liquid-cooled systems. One method to reduce cost is to use fabricate the cold plate using heatsink manufacturing techniques. Case studies are presented to show liquid-cooling with these lower cost cold plates can provide performance that exceeds air-cooling solutions. Finally, suggestions are offered for facilitating the introduction of liquid-cooling systems for future low-profile servers.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.

Copyright © 2005 by ASME
Topics: Cooling

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In