0

Full Content is available to subscribers

Subscribe/Learn More  >

Experimental Study on the Double-Sided Air Cooling for Integrated Power Electronics Modules

[+] Author Affiliations
Ying Feng Pang, Elaine P. Scott, Zhenxian Liang, J. D. van Wyk

Virginia Polytechnic Institute and State University, Blacksburg, VA

Paper No. IPACK2005-73272, pp. 393-400; 8 pages
doi:10.1115/IPACK2005-73272
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

The objective of this work is to quantify the advantages of using double-sided cooling as the thermal management approach for the integrated power electronics modules. To study the potential advantage of the Embedded Power packaging method for the double-sided cooling, experiments were conducted. Three different cases were studied. To eliminate the effect of the heat sink on either side of the module, no heat sink was used in all three cases. The thermal tests were conducted such that the integrated power electronics modules were placed in the middle of flowing air in an insulated wind tunnel. Modules without additional top DBC, with additional top DBC, and with additional top DBC as well as heat spreaders on both sides were tested under the same condition. A common parameter, junction-to-ambient thermal resistance, was used to compare the thermal performance of these three cases. Despite the shortcoming of this parameter in describing the three-dimensional heat flow within the integrated power electronics modules, the concept of the thermal resistance is still worthwhile for evaluating various cooling methods for the module. The results show that increasing the top surface area can help in transferring the heat from the heat source to the ambient through the top side of the module. Consequently, the ability to handle higher power loss can also be increased. In summary, the Embedded Power technology provides an opportunity for implementing double-sided cooling as thermal management approach compared to modules with wire-bonded interconnects for the multichips.

Copyright © 2005 by ASME
Topics: Cooling , Electronics

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In