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Future of Thermal Management of High End Video Cards in ATX and BTX

[+] Author Affiliations
Gamal Refai-Ahmed

ATI Technologies, Inc., Markham, ON, Canada

Mohammed Tantoush

Dell Computer Corporation, Round Rock, TX

Colin Novak

University of Windsor, Windsor, ON, Canada

Paper No. IPACK2005-73219, pp. 287-290; 4 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


The present study aims to examine the future of the thermal management of video cards in PC systems. The primary focus of this investigation is on high end video card applications in both the ATX and BTX platforms. In this article, the thermo-mechanical architecture of these platforms will be revealed along with a discussion of the power density road map of both the graphics processing unit (GPU) and video processor unit (VPU) expected to be in use until the year 2010. Recommendations of how to extend the air cooling limit for video cards in either the ATX or BTX platforms will be part of the conclusions of this study.

Copyright © 2005 by ASME



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