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Thermal-Resistance Measurements on Mechanical Gap Fillers

[+] Author Affiliations
Paul Kolodner, Marc Hodes

Lucent Technologies, Inc., Murray Hill, NJ

Ingo Ewes

Lucent Technologies, Inc., Nürnberg, Germany

Paul Holmes

Lucent Technologies, Inc., Swindon, UK

Paper No. IPACK2005-73084, pp. 91-98; 8 pages
doi:10.1115/IPACK2005-73084
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

This paper discusses spring-loaded mechanical structures that can be used to make thermal connections between an object to be cooled, such as an integrated circuit, and a dissipative structure, like a cooling plate or heat sink. These metal structures are flexible and resilient, adapting to variations in orientation of the two objects to be coupled. Precision experiments and computations demonstrate that they have much lower thermal resistance than elastomeric “gap-filler” pads that are usually used to perform this function.

Copyright © 2005 by ASME

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