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Fabrication and Testing of Microstructure Heat Exchangers for Thermal Applications

[+] Author Affiliations
Juergen J. Brandner, Klaus Schubert

Forschungszentrum Karlsruhe, Karlsruhe, Germany

Paper No. ICMM2005-75071, pp. 657-665; 9 pages
doi:10.1115/ICMM2005-75071
From:
  • ASME 3rd International Conference on Microchannels and Minichannels
  • ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d
  • Toronto, Ontario, Canada, June 13–15, 2005
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4185-5 | eISBN: 0-7918-3758-0
  • Copyright © 2005 by ASME

abstract

For a couple of years, microstructure heat exchangers have been numerically simulated, designed, manufactured and tested at the Institute for Micro Process Engineering of the Forschungszentrum Karlsruhe. The microstructure heat exchangers consist of single metal foils which are connected by a diffusion bonding process to form a nearly monolithic body. The number of integrated microchannels is in the order of several hundreds to several thousands. This internal numbering-up leads to a sufficiently low pressure drop. The devices have an extremely high heat transfer to volume ratio of about 30,000 m2 · m−3 which makes it possible to transfer thermal power in the range of several kilowatt within a volume of some centimeters cubed only.

Copyright © 2005 by ASME

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