0

Full Content is available to subscribers

Subscribe/Learn More  >

Mechanical and Microfluidic Interconnects Fabricated in SU-8 Photopolymer

[+] Author Affiliations
Bonnie L. Gray, Seema Jaffer

Simon Fraser University, Burnaby, BC, Canada

Paper No. ICMM2005-75233, pp. 585-591; 7 pages
doi:10.1115/ICMM2005-75233
From:
  • ASME 3rd International Conference on Microchannels and Minichannels
  • ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d
  • Toronto, Ontario, Canada, June 13–15, 2005
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4185-5 | eISBN: 0-7918-3758-0
  • Copyright © 2005 by ASME

abstract

SU-8 photopolymer is employed to fabricate interlocking structures through which high-density fluidic connections are provided between microchannel containing substrates. Each interconnect is composed of a compliant SU-8 cylinder that deforms to fit when inserted into a silicon or SU-8 hole that is 1–2 μm smaller in initial diameter. Interconnects up to 200 μm in outer radii in SU-8 films 200 μm thick were analyzed and simulated using ANSYS to determine relative strengths and weaknesses of different interconnect designs, as well as determine forces required for assembly and disassembly. Fabricated 200 μm radius interconnects were tested both mechanically and for fluid pressurization. First-order pull-out forces using weights were measured to be 35 mN for fully assembled 100 μm deep interconnects. Pressure testing on a microfluidic board resulted in a maximum pressure of 30 psi (200 kPa) with no leakage using a computer controlled pressure source and water.

Copyright © 2005 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In