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Measurement and Modeling of Condensation Heat Transfer Coefficients in Circular Microchannels

[+] Author Affiliations
Todd M. Bandhauer

Modine Manufacturing Company, Racine, WI

Akhil Agarwal, Srinivas Garimella

Georgia Institute of Technology, Atlanta, GA

Paper No. ICMM2005-75248, pp. 717-728; 12 pages
  • ASME 3rd International Conference on Microchannels and Minichannels
  • ASME 3rd International Conference on Microchannels and Minichannels, Parts A and B
  • Toronto, Ontario, Canada, June 13–15, 2005
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4185-5 | eISBN: 0-7918-3758-0
  • Copyright © 2005 by ASME


A model for predicting heat transfer during condensation of refrigerant R134a in horizontal microchannels is presented. The thermal amplification technique is used to measure condensation heat transfer coefficients accurately over small increments of refrigerant quality across the vapor-liquid dome. A combination of a high flow rate closed loop primary coolant and a low flow rate open loop secondary coolant ensures the accurate measurement of the small heat duties in these microchannels and the deduction of condensation heat transfer coefficients from measured UA values. Measurement were conducted for three circular microchannels (0.5 < Dh < 1.5 mm) over the mass flux range 150 < G < 750 kg/m2 -s. Results from previous work by the authors on condensation flow mechanisms in microchannel geometries were used to interpret the results based on the applicable flow regimes. The heat transfer model is based on the approach originally developed by Traviss et al. (1973) and Moser et al. (1998). The multiple-flow-regime model of Garimella et al. (2005) for predicting condensation pressure drops in microchannels is used to predict the pertinent interfacial shear stresses required in this heat transfer model. The resulting heat transfer model predicts 86% of the data within ±20%.

Copyright © 2005 by ASME



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