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Comparison of Crossflow Micro Heat Exchangers With Different Microstructure Designs

[+] Author Affiliations
Juergen J. Brandner, Torsten Henning, Ulrich Schygulla, Achim Wenka, Stefan Zimmermann, Klaus Schubert

Forschungszentrum Karlsruhe, Karlsruhe, Germany

Paper No. ICMM2005-75072, pp. 493-501; 9 pages
  • ASME 3rd International Conference on Microchannels and Minichannels
  • ASME 3rd International Conference on Microchannels and Minichannels, Parts A and B
  • Toronto, Ontario, Canada, June 13–15, 2005
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4185-5 | eISBN: 0-7918-3758-0
  • Copyright © 2005 by ASME


Microstructure heat exchanger are well known for their superior heat transfer capabilities and the good temperature management for applications. Most microstructure heat exchangers presented so far consisted of a number of microchannels in a defined arrangement to provide the transfer of thermal power from one fluid to another, mostly in laminar flow regime. In this publication, several crossflow microstructure heat exchangers are presented. The devices design ranges from simple linear microchannels of different dimensions and shape, complex micro column arrangements up to three dimensional flow structures like crossed sinusoidally shaped microchannels, a kind of split-and-recombine structure. By comparing experimental results of the most interesting devices, microstructure devices with good performance can be chosen.

Copyright © 2005 by ASME
Topics: Heat exchangers



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