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Micro and Nano Assembly Using Dielectrophoretic Forces (Keynote)

[+] Author Affiliations
Bradley J. Nelson, Lixin Dong, Arunkumar Subramanian, Dominik Bell

Swiss Federal Institute of Technology, Zürich, Switzerland

Barmeshwar Vikramaditya

Seagate Technology, Bloomington, MN

Paper No. ICMM2005-75245, pp. 173-182; 10 pages
  • ASME 3rd International Conference on Microchannels and Minichannels
  • ASME 3rd International Conference on Microchannels and Minichannels, Parts A and B
  • Toronto, Ontario, Canada, June 13–15, 2005
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4185-5 | eISBN: 0-7918-3758-0
  • Copyright © 2005 by ASME


The contact phase of an assembly task involving micro and nano building blocks is complicated by the presence of surface and intermolecular forces such as electrostatic, surface-tension and Van der Waals forces. Assembly strategies must account for the presence of these forces in order to guarantee successful repeatable micro and nanoassemblies with high precision. A detailed model for this electrostatic interaction is developed and analyzed. Based on the results of this analysis, dielectrophoretic assembly principles of MEMS/NEMS devices are proposed and experimentally verified with microtweezers for micro Ni parts and with nanoelectrodes fabricated with electron-beam lithography for carbon nanotube assembly. The successful manipulation and assembly of single carbon nanotubes (CNTs) using dielectrophoretic forces produced by nanoelectrodes will lead to a higher integration of CNTs into both nanoelectronics and NEMS.

Copyright © 2005 by ASME
Topics: Force , Manufacturing



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