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Analytical and Numerical Modeling of Microchannel Heat Sink

[+] Author Affiliations
G. E. Cossali, D. A. Di Pietro, M. Marengo

Università degli Studi di Bergamo, Bergamo, Italy

Paper No. ICMM2003-1092, pp. 713-720; 8 pages
doi:10.1115/ICMM2003-1092
From:
  • ASME 2003 1st International Conference on Microchannels and Minichannels
  • 1st International Conference on Microchannels and Minichannels
  • Rochester, New York, USA, April 24–25, 2003
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-3667-3
  • Copyright © 2003 by ASME

abstract

Analytical and numerical tools for modeling microchannel heat sinks are presented, including the most important project parameters. An analytical 1D model, suitable for both design and performance calculations, is first developed under lumped capacitance assumption and resorting to standard correlations for Nu under H1 boundary conditions. 2D model extensions are then provided separately for poorly and highly conductive substrates: in the former case axial conduction is neglected; in the latter case the 2D model is modified to include axial conduction by exploiting the results from 1D model. This innovative approach provides a significant reduction in computational costs with respect to a conventional 3D model. A 3D model is then developed to evaluate the effects of thermal entrance. Finally, some optimization calculations are performed.

Copyright © 2003 by ASME

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