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Numerical Analysis of Conduction in a Foam

[+] Author Affiliations
A. M. Druma, M. K. Alam, C. Druma

Ohio University, Athens, OH

Paper No. IMECE2002-39550, pp. 285-291; 7 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 7
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3638-X | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


Porous organic materials are being developed for use as insulation, heat spreaders, and compact heat exchanger cores. The bulk properties of such a porous medium are difficult to determine analytically, particularly for the case of high porosity or when the porous material is not isotropic or homogeneous. Models that predict thermal conductivity of foams often use an empirical parameter to account for the effect of pore shape and material microstructure on the conduction process. A finite element analysis has been developed to calculate the thermal conductivity of a porous medium containing micropores. The effective thermal conductivity and the empirical conduction parameter are evaluated by comparing the results of the analytical and numerical models.

Copyright © 2002 by ASME



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