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Electrical and Thermal Layout Design and Optimization Considerations for DPS Active IPEM

[+] Author Affiliations
Ying Feng Pang, Jonah Zhou Chen, Elaine P. Scott, Karen A. Thole

Virginia Polytechnic Institute and State University, Blacksburg, VA

Paper No. IMECE2002-33778, pp. 253-259; 7 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 7
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3638-X | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the thermal analysis, which was performed using 3D finite element and computational fluid dynamic (CFD) analyses. A parametric study was conducted to determine the thermal performance of several different design layouts. A sensitivity analysis was performed to determine the overall uncertainty of the predicted simulations. The final design, Gen-II.C, provided a 70% reduction in the common mode current, a 4% reduction in the size of the geometric footprint, and a 3°C reduction in the maximum temperature over Gen-II.A, thus providing an increase in the overall performance.

Copyright © 2002 by ASME
Topics: Design , Optimization



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