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Modeling of Forced Convection in an Electronic Device Heat Sink as Porous Media Flow

[+] Author Affiliations
Andrej Horvat

Institut Jožef Stefan, Ljubljana, Slovenia

Ivan Catton

University of California, Los Angeles, CA

Paper No. IMECE2002-39246, pp. 207-212; 6 pages
doi:10.1115/IMECE2002-39246
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 7
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3638-X | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

An algorithm for simulation of conjugate heat transfer used to find the most suitable geometry for an electronic chip heat sink is described. Applying Volume Averaging Theory (VAT) to a system of transport equations, a heat exchanger structure was modeled as a homogeneous porous media. The interaction between the fluid and the structure, the VAT equation closure requirement, was accomplished with drag and heat transfer coefficients, which were taken from the available literature and inserted into a computer code. The example calculations were performed for an aluminum heat sink exposed to force convection airflow. The geometry of the simulation domain and boundary conditions followed the geometry of the experimental test section. The comparison of the whole-section drag coefficient and Nusselt number as functions of Reynolds number shows a good agreement with the experimental data. The calculated temperature fields reveal the local heat flow distribution and enable further improvements of the heat sink geometry.

Copyright © 2002 by ASME

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