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Closed Loop Impingement Cooling System for High Power Density Electronic Devices

[+] Author Affiliations
Avijit Bhunia, Chung-Lung Chen

Rockwell Scientific Company, Thousand Oaks, CA

Paper No. IMECE2002-33729, pp. 157-163; 7 pages
doi:10.1115/IMECE2002-33729
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 7
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3638-X | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

Liquid jet and droplet impingement cooling of the 1cm2 base plate area of a 1mm2 Silicon carbide diode is reported. DI water flowing from a single or two-orifice injection port of diameter 118–130μm at a rate of 4.5–15ml/min, impinges on the diode base plate and undergoes phase change. For practical implementation of liquid impingement cooled electronic devices, a closed loop system with a recovery scheme for the vapor and the excess liquid is developed. Boiling of the thin liquid film on the base plate surface is observed at a superheat of 10°C, measured at a location 3.2mm away from the diode footprint area on the base plate, and a maximum phase change heat transfer effectiveness of 39%. The effects of liquid flow rate, and injection pattern (single or two-orifice) on the heat transfer and the diode current-voltage characteristics are investigated.

Copyright © 2002 by ASME

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