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Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 1 — Experimental

[+] Author Affiliations
Ravi S. Prasher, Jim Shipley, Suzana Prstic, Paul Koning, Jin-Lin Wang

Intel Corporation, Chandler, AZ

Paper No. IMECE2002-32117, pp. 47-51; 5 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 7
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3638-X | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research groups have primarily dealt with the understanding of the thermal conductivity of these types of TIMs. Thermal resistance is not only dependent on the thermal conductivity but also on the bond line thickness (BLT) of these TIMs. It is not clear that which material property(s) of these particle laden TIMs affects the BLT. This paper discusses the experimental measurement of rheological parameters such as non-Newtonian strain rate dependent viscosity and yield stress for 3 different particle volume fraction and 3 different base polymer viscosity materials. These rheological and BLT measurements vs. pressure will be used to model the BLT of particle-laden systems for factors such as volume fraction.

Copyright © 2002 by ASME



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