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A Subgrid Physics Model for Multi-Length Scale Thermal Analysis of MEMS

[+] Author Affiliations
C. Channy Wong

Sandia National Laboratories

Paper No. IMECE2005-79613, pp. 627-634; 8 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Microelectromechanical Systems Division
  • ISBN: 0-7918-4224-X | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


A subgrid physics model has been developed to analyze heat transfer in an integrated microsystem. By modeling the ‘multi-mode’ phonon scattering process in microstructures, the dominant microscale heat transfer mechanisms such as phonon scattering at thin-film boundaries and at grain boundaries will be captured. Thus a localized anisotropic thermal conductivity can be calculated for use in system analysis. With this new capability, a continuum thermal analysis tool can address thermal problems with multiple characteristic length scales. To demonstrate its capability, this subgrid physics model has been applied to simulate the thermal response of a microscale optical shutter. Result shows that internal material structures such as grain size can significantly change the thermal response of a microsystem.

Copyright © 2005 by ASME



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