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High Performance Microvalve Array

[+] Author Affiliations
Dong Gun Lee, Daniel D. Shin, Gregory P. Carman

University of California at Los Angeles

Paper No. IMECE2005-79294, pp. 611-615; 5 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Microelectromechanical Systems Division
  • ISBN: 0-7918-4224-X | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


The fabrication, analysis, and testing of a large flow rate and high frequency microvalve array are presented in this paper. The array consists of 88-microvalves fabricated on a silicon-on-insulator (SOI) substrate. The SOI wafer simplifies the fabrication process and eliminates the need for multi-layer surface micromachining process and bulk wafer-bonding procedures. The analytical resonant frequency of the valve is up to 50 kHz and operates at high delta pressures (i.e. 0.14 MPa). The microvalves are fabricated with various flap widths ranging from 300 to 400 μm and flap thickness ranging from 10 to 13 μm. The results indicate that flap displacement and flow rate are strongly dependent on flap thicknesses and to a lesser degree on flap widths increases. The resonance frequency with valve flap thickness increases and width decreases. Comparison between predicted and measured flow rate shows good agreement. A flow rate up to 35 cc/sec was measured. A failure criterion is also presented using the fracture stress analysis and shows good agreement with experimental result.

Copyright © 2005 by ASME



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