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Interconnecting Microfluidic Package and Hybrid Interface for Chip-Based Sensor

[+] Author Affiliations
Naveenkumar S. Palsandram, Peng Zhang, Michael Pepper, Hyoung J. Cho

University of Central Florida

Moosung Lee

Chonnam National University

Paper No. IMECE2005-82031, pp. 177-181; 5 pages
doi:10.1115/IMECE2005-82031
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Microelectromechanical Systems Division
  • ISBN: 0-7918-4224-X | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

In realizing a portable chemical analysis system, adequate partitioning of a reusable component and a disposable is required. For successful implementation of micromachined sensors in an instrument, reliable methods for interconnection and interface are in great demand between these two major parts. In this work we investigated interconnection methods of micromachined chip devices and hybrid fluidic interface system. The interconnection method based on micromachining and injection molding techniques was developed and an interconnecting microfluidic package was designed, fabricated and tested. For the hybrid interface, sequencing of the chemical analysis was examined and accordingly, syringe containers, a peristaltic pump and pinch valves were assembled to compose a reliable meso-scale fluidic control unit. The system using the interconnecting package and the hybrid interface was tested for a chip-based sensor.

Copyright © 2005 by ASME

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