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A Dual-EDM Reverse Damascene Process for RF Switches and Other Bulk Metal Devices

[+] Author Affiliations
K. Udeshi, M. Richardson, J.-J. Hung, L. Que, G. M. Rebeiz, Y. B. Gianchandani

University of Michigan

Paper No. IMECE2005-80913, pp. 137-141; 5 pages
doi:10.1115/IMECE2005-80913
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Microelectromechanical Systems Division
  • ISBN: 0-7918-4224-X | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

This paper reports a manufacturing process suitable for lithography-compatible fabrication of suspended micro-structures from any conductive material (including bulk metal) that is available in sheet form. It uses two aligned steps of batch mode micro-electro-discharge machining followed by a series of filling and lapping steps similar to a damascene process. The process is demonstrated by the fabrication of a bi-stable RF switch from #302 stainless steel foil. The fabricated devices have a footprint of 5 × 5 mm2 , with 25 μm thickness, and a minimum feature size of 5 μm.

Copyright © 2005 by ASME

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