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Single-Step, Integrated Assembly and Encapsulation of Microfluidic Bubble Generator

[+] Author Affiliations
Emil J. Geiger, Julian M. Lippmann, Jeremy A. Frank, Albert P. Pisano

University of California at Berkeley

Paper No. IMECE2005-80105, pp. 127-130; 4 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Microelectromechanical Systems Division
  • ISBN: 0-7918-4224-X | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


This paper describes a single-step method for assembling and encapsulating a microbubble chamber in which injection-molded plastic secures the fluidic and electrical interconnects. All of the necessary components for the chamber are loose assembled in a plastic-injection mold and subsequently packaged, encapsulated, and sealed in one molding step. These components include a silicon/Pyrex® bubble chamber, copper electrical leads, and small-gauge stainless steel fluidic headers. This approach delivers a fully integrated microbubble chamber with 1) zero dead volume, 2) low electrical contact resistance (<1 Ohm), 3) low compliance, in-plane fluid interconnects and 4) small overall dimensions (7.5 mm × 4 mm × 3 mm) conforming to the Dual In-Line Package (DIP) standard, Fig 1.

Copyright © 2005 by ASME



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