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Model Based Development of an Integrated Sensor-Actuator System for Online Quality Monitoring in Ultrasonic Wire Bonding

[+] Author Affiliations
Michael Brökelmann, Jörg Wallaschek

University of Paderborn

Hans J. Hesse

Hesse & Knipps GmbH

Paper No. IMECE2005-80790, pp. 219-226; 8 pages
doi:10.1115/IMECE2005-80790
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Aerospace
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Aerospace Division
  • ISBN: 0-7918-4210-X | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.

Copyright © 2005 by ASME

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