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The Assessment of Residual Stress Effects on Ductile Tearing Using Continuum Damage Mechanics

[+] Author Affiliations
Andrew H. Sherry

University of Manchester, Manchester, UK

Mark A. Wilkes, John K. Sharples

Serco Assurance, Warrington, UK

Peter J. Budden

British Energy Generation, Ltd., Gloucester, UK

Paper No. PVP2005-71348, pp. 791-797; 7 pages
  • ASME 2005 Pressure Vessels and Piping Conference
  • Volume 6: Materials and Fabrication
  • Denver, Colorado, USA, July 17–21, 2005
  • Conference Sponsors: Pressure Vessels and Piping Division
  • ISBN: 0-7918-4191-X | eISBN: 0-7918-3763-7
  • Copyright © 2005 by ASME


This paper presents the results of a numerical study undertaken to assess the influence of residual stresses on the ductile tearing behaviour of a high strength, low toughness aluminium alloy. The Gurson-Tvergaard model [1, 2] was calibrated against conventional fracture toughness data using parameters relating to void nucleation, growth and coalescence. The calibrated model was used to predict the load versus ductile tearing behaviour of a series of full-scale and quarter-scale wide-plate tests. These centre-cracked tension tests included specimens that contained a self-balancing residual stress field that was tensile in the region of the through-wall crack. Analyses of the full-scale wide-plate tests indicated that the model provides a good prediction of the load versus ductile tearing behaviour up to approximately 3 mm of stable tearing. The influence of residual stress on the load versus crack growth behaviour was accurately simulated. Predictions of the load versus crack growth behaviour of full-scale wide-plate tests for crack extensions greater than 3 mm, and of the quarter-scale tests, were low in terms of predicted load at a given amount of tearing. This was considered to result from: (i) the ‘valid’ calibration range in terms of specimen thickness and crack extension, (ii) the development of shear lips and (iii) differences in the micro-mechanism of ductile void formation under plane strain and under plane stress conditions.

Copyright © 2005 by ASME
Topics: Stress



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