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Determination of Interfacial Fracture Toughness for Thin Film Coating Materials

[+] Author Affiliations
John Jy-An Wang, Ian G. Wright, Michael J. Lance, Ken C. Liu

Oak Ridge National Laboratory, Oak Ridge, TN

Paper No. PVP2005-71778, pp. 229-238; 10 pages
doi:10.1115/PVP2005-71778
From:
  • ASME 2005 Pressure Vessels and Piping Conference
  • Volume 6: Materials and Fabrication
  • Denver, Colorado, USA, July 17–21, 2005
  • Conference Sponsors: Pressure Vessels and Piping Division
  • ISBN: 0-7918-4191-X | eISBN: 0-7918-3763-7
  • Copyright © 2005 by ASME

abstract

A material configuration of central importance in composite materials or in protective coating technology is a thin film of one material deposited onto a substrate of a different material. Fabrication of such a structure inevitably gives rise to stress in the film due to lattice mismatch, differing coefficient of thermal expansion, chemical reactions, or other physical effects. Therefore, in general, the weakest link in this composite system often resides at the interface between the thin film and substrate. In order to make multi-layered electronic devices and structural composites with long-term reliability, the fracture behavior of the material interfaces must be known. This project is intended to address the problems associated with interface fracture toughness evaluation and offers an innovative testing procedure for the determination of interface fracture toughness applicable to thin coating materials in general.

Copyright © 2005 by ASME

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